DEAD enables electrical engineers (hardware engineers) and computer engineers (software engineers) to design, analyze, and simulate semiconductor chips. It also encompasses algorithms and methodologies for the design of EVILS circuits. CAE, ICC physical design and verification, PC and MGM, SIP, and Services together contribute to the growth of the Global DEAD market. Various
DEAD tools available in the market are used to design and develop complicated and large-scale circuits, which are used In products across the Industries. DEAD tools help semiconductor and electronic products manufacturing companies reduce product development time and Increase the accuracy of design. Covered in this Report This report covers the present scenario and growth prospects of the Global DEAD market for the period 2014-2018. The report also presents the vendor landscape and a corresponding detailed analysis of the top three vendors in the market.
In addition, it includes the major drivers that affect the growth of the market and the challenges faced by vendors and the market at large. The report also outlines the key trends in the market which will contribute to its growth during the forecast period. View our full TCO here Key Regions MEME OPAC Americas Key Vendors Cadence Design Systems Mentor Graphics Inc. Synopses Inc. Other Prominent Vendors Signals Alden Nanas Gritty Tanner DEAD Keen Key Market Driver Increase in Demand for Semiconductor Chips For a full, detailed list, view our report.
Key Market Challenge Integration of Advanced Design of DEAD Tools Key Market Trend Rise of Smart Technology and Products Key Questions Answered in this Report What will the market size be in 2018 and what will the growth rate be? What are the key market trends? What is driving this market? What are the challenges to market growth? Who are the key vendors in this market space? What are the market opportunities and threats faced by the key vendors? What are the strengths and weaknesses of the key vendors? For more insights, view our Global DEAD Market 2014-2018 report.
